NDS Polishing Template / Polishing Pad
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- Application
- This is to replace traditional method of wafer fixing during Chemical Mechanical Polishing (CMP) process. No more worry of waxy residue and wax cleaning process. It offers cushion benefit for best protection for various kinds of wafers. Together with slurry, the poromeric material of template absorbs sufficient moisture after wetting and produces necessary adhesion to hold the wafer well. The superior performance of template can reduce machine down time and increase productivity.
It can be used for single-sided polishing applications.
- Features
- Good mounting performance
- Can be applied to varieties of wafers
- Longer lifespan
- Customize design for pocket dimensions and depths
- Application
- It is applied to coarse, middle and fine polishing during the Chemical Mechanical Polishing (CMP) process. With advance PU foaming technology, high planarization and removal rate can be achieved. NDS polishing pads are customized for polishing varieties of workpieces such as silicon wafers, reclaim wafers, SiC, GaAs, sapphire, quartz, ceramic and etc.
- Features
- Customize groove designs for better liquid discharge and debris removal
- High planarization and low defect
- Excellent abrasion resistance
- Varieties of groove patterns available upon request
Relative Products
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Energy-saving / PUE<1.1
- NDS Polishing Template Polishing Pad
- Automatic Dicing Saw
Totally Dicing - Dicing Blades
- Resin Bond Blade
- New Metal Bond Blade for dicing system-in-package (SiP)
- Metal Bond Blade
- Electroformed Bond Blade
- Vitrified Bond Blade
- Hub Blade
- Tapes
- Grinding Wheel
- Dicing Accessories
- Auxiliary Machines
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TEL : +886-4-23597885 / FAX : +886-4-23597889 / 7F.-3, No.210, Gongyequ 38th Rd., Xitun Dist., Taichung City 407, Taiwan
Copyright © NDS. All rights reserved. | NDS Youtube | Google plus
TEL : +886-4-23597885 / FAX : +886-4-23597889 / 7F.-3, No.210, Gongyequ 38th Rd., Xitun Dist., Taichung City 407, Taiwan